Apple's 2026 iPhones will use TSMC's next-generation 2-nanometer fabrication process in combination with a new packaging method that will integrate 12GB of RAM, a reputable source of accurate ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Apple A20 could be priced at $280 per unit, as per a new report. This reportedly accounts for more than 80% price hike over ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

Apple's next iPhone 17 models are expected to be the last to feature a 3nm chip. This technology was first introduced with the iPhone 14 Pro, and Apple has been improving its manufacturing processes.

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

The A20 chip will arrive in 2026 with the iPhone 18 generation. Image: D. Griffin Jones/Cult of Mac Apple’s A20 chip, which likely will power the iPhone 18 Pro and folding iPhone, reportedly will use ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...