Metrology tool vendor Rudolph Technologies Inc. took the wraps off a suite of macro defect equipment today, claiming that it can produce real-time inspection on each critical lithography and wafer ...
MINNEAPOLIS — August Technology Corp. has rolled out its latest NSX Series of automated macro defect inspection tools for advanced metrology applications. The NSX-115 is optimized for 2D gold and ...
The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. All of this comes at a time when the ...
insights from industryDr. Thomas FriesFounder and CEOFRT GmbH In this article, AZoM, talks to Dr. Thomas Fries, Founder and CEO of FRT GmbH, about the applications of both defect inspection and ...
Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these ...
San Francisco, CA. KLA-Tencor today announced two new defect-inspection products, addressing key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the ...
FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC) today announced the widespread adoption and success of its newest macro defect inspection tool, the NSX ® 330 Series. The NSX ...
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
Dublin, Oct. 16, 2020 (GLOBE NEWSWIRE) -- The "Metrology, Inspection, and Process Control in VLSI Manufacturing" report from The Information Network has been added to ResearchAndMarkets.com's offering ...
Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
Application of more rigorous engineering assessment methods, such as probability of exceedance, to in-line inspection data provides a more reliable procedure for pipeline integrity management than ...
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