The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...
NEWPORT BEACH, Calif.–Conexant Systems Inc. here today (Feb. 20) announced an agreement to exchange rights to IC packaging technologies with Taiwan's Advanced Semiconductor Engineering Inc. (ASE).
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
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