So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

The chip market is facing a wave of price increases, with companies issuing hike notices and foundries preparing to raise prices for the 8-inch wafer process amid current supply-demand dynamics. Many ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Julia Kagan is a financial/consumer journalist and former senior editor, personal finance, of Investopedia. Eric's career includes extensive work in both public and corporate accounting with ...

Driven by rapid growth in AI and high-performance computing (HPC) markets, semiconductor IC test equipment leader Hon Precision has upgraded its production expansion plan for 2026 from an annual ...

Collectively, the startup’s founding team has 10 decades of experience in chip design, AI applications and product development at Texas Instruments, Qualcomm and other global companies, alongside 70 ...

Chip exports hit US$43.3 billion in January and February, outpacing China's overall export growth of 21.8 per cent in the same period China's chip exports jumped in the first two months of the year, ...