Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip components, and thus improve the speed of devices without having to ...

"Hot Chips" sounds like a nice side dish, but is in fact a technological symposium held yearly in Silicon Valley. It's a place for processor vendors to talk about their latest innovations, and while ...

Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...

In brief: With a new submission in the 3DMark database, it would appear Intel already has samples of its Lakefield chips out in the wild. Lakefield will use Intel's 3D Forevos chip stacking technology ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

Stephen Shankland worked at CNET from 1998 to 2024 and wrote about processors, digital photography, AI, quantum computing, computer science, materials science, supercomputers, drones, browsers, 3D ...

The big picture: Intel shared several next-gen technologies at its recent Architecture Day but Foveros 3D stacking may hold the most long-term promise. Its impact will all depend on how many product ...

Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its ...

Intel has announced its first 'Lakefield' hybrid CPUs to make use of its Foveros 3D chip stacking technology. The Core i5-15G7 and Core i3-13G4 are 7W 'Sunny Cove' parts that use a 10nm manufacturing ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...