For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...
Now available from multiple sources, a 3.3-mm x 3.3-mm MOSFET package reduces pc-board space requirements by up to 63% versus the SO-8, while offering similar thermal and electrical performance. Spiro ...
Toshiba has created a gull-wing mosfet package specifically for high current automotive applications, and has released a 400A 40V mosfet in it. Branded L-TOGL and measuring 9.9 x 11.8 x 2.3mm (right), ...
STMicroelectronics has licensed a power Mosfet packaging technology from US firm Siliconix which is designed to offer improved heat dissipation characteristics. “With the size of DC-to-DC power ...
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