Printed Circuit Design & Fab Online Magazine

Metal-Core PCBs and Thermal Management

Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
Hackaday

metal core pcb

We wonder if [Carl Bugeja] was looking at a 3D printer’s heated bed when he got the idea to create a PCB reflow heater using a PCB. He tried a quick test to heat up a standard PCB and made it ...
Digi Times

Eco-friendly PCBs: Elephantech's metal inkjet printing

Japanese startup Elephantech is pioneering an innovative manufacturing technology that could significantly reduce the environmental impact of producing Printed Circuit Boards (PCBs). If successful, ...
Semiconductor Engineering

Embedded Die Packaging Emerges

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
eturbonews

Substrate-like PCB Market Landscape Development, Industry analysis and Growth Opportunities | Kinsus Interconnect Technology, IBIDEN CO.

Pune, Maharashtra, India, October 20 2020 (Wiredrelease) MarketResearch.Biz –:An extensive and elaborate primary research on Global Substrate-like PCB Market report sheds light on numerous facets such ...
Yahoo Finance

Advanced IC Substrate Market 2025-2035 | Glass Core Substrates and Embedded Die Technologies Reshape Semiconductor Packaging

Dublin, May 15, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is ...