Business Wire

OSFP MSA Announces Release of OSFP 4.0 Specification for 800G Modules

SANTA CLARA, Calif.--(BUSINESS WIRE)--The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) group today announces the release of the OSFP 4.0 Specification for 800G OSFP modules.
Business Wire

OSFP MSA Group Announces Form Factor Specification

LOS ANGELES--(BUSINESS WIRE)--The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) Group has released the electrical and mechanical specifications for the new OSFP form factor. A ...
Morningstar

OpenZR+ MSA Group Releases Rev 3.0 Specification to Further Expand Application Use Cases for Open, Flexible and Interoperable Coherent Pluggable Solutions

Signaling another milestone towards multi-vendor interoperability of enhanced performance coherent pluggable modules, the OpenZR+ Multi-Source Agreement (MSA) Group today announced that it has ...
PR Newswire

Semiconductor Test Socket Market Size to Grow USD 1833.8 Million by 2030 at a CAGR of 7% | Valuates Reports

BANGALORE, India, July 11, 2024 /PRNewswire/ -- Semiconductor Test Socket Market is Segmented by Type (Burn-in Socket, Test Socket), by Application (IC Design Company, Packaging Company, IDM, ...