A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the technology ...

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on ...

Eventually, almost every EE must design a PCB, which isn’t something that’s taught in school. Yet engineers, technicians, and even novice PCB designers can create high-quality PCBs for any and every ...