Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
“Launching a new Surfscan platform is an exciting event for KLA-Tencor,” said Ali Salehpour, senior vice president and general manager of the Surfscan / ADE division at KLA-Tencor. “The visible-light ...
Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...
In semiconductor manufacturing, a process called chemical mechanical planarization (CMP) is used for polishing wafer surfaces. CMP uses a slurry that contains both functional chemicals and ...
Applied Materials Inc. will integrate single-wafer vapor drying technology from SCP Global Technologies into its Applied Reflexion LK CMP system, the company announced today. Applied has obtained a ...
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