Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

According to news reports, Samsung and TSMC are expected to enter 5nm process mass production in 2020. The competition in 5nm wafer yield and market share will be very intense. A brand new wafer ...

Creating two-dimentional materials large enough to use in electronics is a challenge despite huge effort but now, Penn State researchers have discovered a method for improving the quality of one class ...

As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...